What does an Electroplating Circuit constitute of?

Electrolyte:

An electrolyte solution is prepared, containing ions of the metal to be plated and a suitable solvent.

At the Cathode: 

The object to be electroplated, called the substrate or the cathode, is connected to the negative terminal of the power source.

At the Anode:

A metal electrode of the same metal as the ions in the electrolyte, called the anode, is connected to the positive terminal of the power source.

Ionization of Electrolyte: 

The electrolyte contains metal ions that are dissolved in the solution.

For example, if copper is to be electroplated, the electrolyte may contain copper sulfate (CuSO4) dissolved in water.

Electrolysis Process

• When the electric current is applied, metal cations from the electrolyte are attracted to the negatively charged cathode (substrate).
• At the cathode, reduction occurs, and the metal cations gain electrons, forming a layer of metal on the surface of the substrate.

In copper electroplating:

• Copper cations (Cu2+) from the electrolyte are reduced and deposited as copper metal (Cu) onto the cathode.
• Cu2+ (aq) + 2e_ → Cu (s)

Anode:

• The anode, which is made of the same metal as the ions in the electrolyte, slowly dissolves into the electrolyte.
• It replenishes the metal ions in the solution to maintain the concentration required for the plating process.
• For copper electroplating, a copper anode is used.